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Key Features

No matter how heavy and numerous the applications that you are using, 5600 MHz memory speed with registered signal will run them smoothly
DIMM 16 GB bar will run multiple applications together and enhance your computer's performance
Enables efficient and smooth execution of all your heavy-duty applications with maximum productivity
Registered signal processing allows convenient and easy reconfiguration according to your requirements
288-pin for optimal performance and maximum reliability
DIMM form factor with 288-pin and 16 GB memory size effectively reduces minimizes the load on the server memory BUS to ensure maximum productivity
Server device support for your RAM Module to allow enhanced system performance and reliable memory solution
TruDDR5 memory technology seamlessly handles multiple programs together to ensure optimal, crash-free RAM Module usability

LENOVO DATA CENTER RAM Modules

16GB1RX8PC5-560016GB

Mfr # 4X77A88087 SKU 14060345 UPC 889488698073

$2,648.94 MSRP $3,099.00 Save 15%

Regular price saves you $450.06 against MSRP.

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Product Overview

16GB1RX8PC5-560016GB

Lenovo RAM Module - For Server - 16 GB - DDR5-5600/PC5-44800 TruDDR5 - 5600 MHz Single-rank Memory - Registered - 288-pin - DIMM
For Server - 16 GB - DDR5-5600/PC5-44800 TruDDR5 - 5600 MHz Single-rank Memory - Registered - 288-pin - DIMM
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Technical Specifications

Product Type	RAM Module
Device Supported	Server
Manufacturer Part Number	4X77A88087
Number of Pins	288-pin
Signal Processing	Registered
Form Factor	DIMM
Manufacturer	Lenovo Group Limited
Memory Speed	5600 MHz
Product Name	RAM Module
Memory Size	16 GB
Brand Name	Lenovo
Memory Technology	TruDDR5
Memory Standard	DDR5-5600/PC5-44800
Memory Rank	Single-rank

Marketing Information

Intel Servers

Lenovo Servers:

T650 V3 (7D7B / 7D7A)
S R630 V3 (7D72 / 7D73)
S R650 V3 (7D75 / 7D76)
S D650 V3 (7D7M)

Lenovo ThinkSystem Memory Summary | Reference Information

ThinkSystem TruDDR5 and TruDDR4 memory delivers trusted, tested, quality, performance, and reliability throughout the ThinkSystem portfolio. We use the highest quality industry-standard memory components sourced from Tier 1 DRAM suppliers. Only memory that meets these strict requirements are selected for memory in Lenovo servers. It is then compatibility tested and tuned on every ThinkSystem server to maximize reliability.

In addition, Lenovo memory DIMMs for servers have a unique signature programmed into them so your system can verify that TruDDR5 and TruDDR4 memory is installed in your system. Since the memory will be authenticated, memory stretch goals are enabled only when TruDDR4 memory DIMMs are detected. Together with lower power consumption, these new DIMMs can provide the lowest TCO for data centers.

High Performance Memory

Lenovo offers high-performance and high-capacity memory options in ThinkSystem servers.

Performance+ Memory

Memory intensive workloads needing a competitive advantage will benefit from Lenovo's Performance+ memory. Lenovo engineers worked in partnership with leading memory suppliers to develop and tune ThinkSystem servers enabling them to exceed the latest industry standard for memory performance.

In ThinkSystem V3 servers with 5th Gen Intel Xeon Scalable processors, Lenovo's Performance+ memory delivers increased memory speed at up to 4800 MHz with two memory channels populated.

Persistent Memory

Lenovo ThinkSystem servers configured with Intel Optane Persistent Memory transforms the memory/storage hierarchy enabling faster insights from data. This breakthrough technology delivers large capacity, high speed, affordable memory with data persistence and advanced encryption capabilities. These modules significantly increase the capacity of available system memory, keeping more hot data closer to the CPU, and enabling greater operational efficiency by processing larger data sets with more user instances.

3DS RDIMMs

To meet the ever increasing demand for higher density server memory modules, Lenovo offers 3DS (3 Dimensional Stacked) DDR4 RDIMMs which apply TSV (Through Silicon Via) technology from our partnership with a leading Tier 1 DRAM supplier. The new TSV 3DS stack technology enables higher density DRAM stack packages with higher operational frequency and reduced power consumption. The RDIMM configuration along with 3DS TSV DRAM packages exhibits performance benefits and lower power consumption over alternative high density solutions to ultimately provide the lowest TCO for data centers.