256GB, M.2 2280, PCIE GEN3X4, M-KEY, 3D TLC BICS4, PE: 3K, 8C

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Key Features

PCI Express NVMe 3.0 x4 interfaceenables quick data transfer and higher throughput
M.2 2280 form factor offers convenience, making it perfect for users seeking easy installation and hassle-free operation
Power and energy-efficient design ensures maximum reliability for your SSD
Provides expanded storage capacity with optimal efficiency, ensuring you have ample space for all your needs
With a capacity of 256 GB, enjoy extensive storage space for all your documents and data

TRANSCEND INFORMATION Hard Drives/Solid State Drives

256GB, M.2 2280, PCIE GEN3X4, M-KEY, 3D TLC BICS4, PE: 3K, 8C

Mfr # TS256GMTE662T2 SKU 6626452 UPC 760557854326

$462.30

Available

Product Overview

256GB M.2 2280 PCIE GEN3X4 M-KEY 3D TLC BICS4 PE 3K 8CH 30U
Transcend MTE662T2 256 GB Solid State Drive - M.2 2280 Internal - PCI Express NVMe (PCI Express NVMe 3.0 x4) - Desktop PC Device Supported - 2 DWPD - 3 Year Warranty
Transcend MTE662T2 256 GB Solid State Drive - M.2 2280 Internal - PCI Express NVMe (PCI Express NVMe 3.0 x4)
Desktop PC Device Supported - 2 DWPD - 3 Year Warranty

Technical Specifications

Product Type	Solid State Drive
Device Supported	Desktop PC
Storage Capacity	256 GB
Manufacturer Part Number	TS256GMTE662T2
Limited Warranty	3 Year
Weight (Approximate)	0.32 oz
Drive Type	Internal
Form Factor	M.2 2280
Length	3.1"
Manufacturer	Transcend Information, Inc
Product Model	MTE662T2
Product Name	MTE662T2 Solid State Drive
Brand Name	Transcend
Height	0.1"
Width	0.9"
Environmentally Friendly	Yes
Wireless LAN	No
Drive Interface	PCI Express NVMe
Drive Interface Standard	PCI Express NVMe 3.0 x4
Endurance (DWPD)	2
Environmental Compliance	Restriction of Hazardous Substances (RoHS) 2

Marketing Information

Intel Mini PC BKNUC9VXQNX
Intel Mini PC BKNUC9VXQNX2

Transcend's MTE662T2 M.2 SSD features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. The MTE662T2 features state-of-the-art 3D NAND technology, which allows 96 layers of 3D NAND flash chips to be vertically stacked. Compared to 3D NAND at 64 layers, this density breakthrough greatly improves storage efficiency, and its built-in DRAM cache allows faster access. Applied with 30µ" gold finger PCB and Corner Bond technology, the MTE662T2 is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20?~75?.

Technologies

96-layer 3D NAND Flash
30µ" PCB Gold Finger
Corner Bond
Extended Temperature
Dynamic Thermal Throttling
Thermal Sensor
Read Disturbance
Garbage Collection
Wear Leveling
TRIM
Bad Block Management
Early Move

Firmware Features

Supports NVM command
SLC caching technology
Dynamic thermal throttling
Built-in LDPC ECC (Error Correction Code) functionality
Advanced Global Wear-Leveling and Block management for reliability
Advanced Garbage Collection
Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
Full drive encryption with Advanced Encryption Standard (AES) (optional)

Hardware Features

Compliant with RoHS 2.0 standards
Compliant with NVM Express specification 1.3
Compliant with PCI Express specification 3.1
Space-saving M.2 form factor (80mm) - ideal for mobile computing devices
PCIe Gen 3 x4 interface
DDR4 DRAM Cache embedded
Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
Key components fortified by default with Corner Bond technology
30µ" PCB gold finger
Promised operational reliability in an extended temperature range (from -20°C to 75°C)
Supports Transcend Scope Pro software