Key Features
- PCI Express NVMe 3.0 x4 interfaceguarantees quick and reliable data transfer
- M.2 2280 form factor offers convenience, making it perfect for users seeking easy installation and hassle-free operation
- Power and energy-efficient design ensures maximum reliability for your SSD
- Provides expanded storage capacity with optimal efficiency, ensuring you have ample space for all your needs
- Store unlimited documents, pictures, and videos with the impressive 1 TB capacity
1TB, M.2 2280, PCIE GEN3X4, M-KEY, 3D TLC BICS4, PE: 3K, 8C
TS1TMTE662T2
SKU 6626447
UPC 760557844617
Contact us to check availability
Product Overview
1TB, M.2 2280, PCIE GEN3X4, M-KEY, 3D TLC BICS4, PE: 3K, 8C
- 1TB, M.2 2280, PCIe Gen3x4, M-Key, 3D TLC, PE: 3K, 8CH, 30u
- Transcend MTE662T2 1 TB Solid State Drive - M.2 2280 Internal - PCI Express NVMe (PCI Express NVMe 3.0 x4) - 2 DWPD
- Transcend MTE662T2 1 TB Solid State Drive - M.2 2280 Internal - PCI Express NVMe (PCI Express NVMe 3.0 x4)
Technical Specifications
| Product Type | Solid State Drive |
| Storage Capacity | 1 TB |
| Manufacturer Part Number | TS1TMTE662T2 |
| Weight (Approximate) | 0.32 oz |
| Drive Type | Internal |
| Form Factor | M.2 2280 |
| Manufacturer | Transcend Information, Inc |
| Product Model | MTE662T2 |
| Product Name | Solid State Drive |
| Brand Name | Transcend |
| Height | 0.1" |
| Width | 0.9" |
| Depth | 3.1" |
| Wireless LAN | No |
| Drive Interface | PCI Express NVMe |
| Drive Interface Standard | PCI Express NVMe 3.0 x4 |
| Endurance (DWPD) | 2 |
Marketing Information
Transcend's MTE662T2 M.2 SSD features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. The MTE662T2 features state-of-the-art 3D NAND technology, which allows 96 layers of 3D NAND flash chips to be vertically stacked. Compared to 3D NAND at 64 layers, this density breakthrough greatly improves storage efficiency, and its built-in DRAM cache allows faster access. Applied with 30µ" gold finger PCB and Corner Bond technology, the MTE662T2 is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20?~75?.
Shipping & Dimensions
Similar Products
TRANSCEND 1TB, M.2 2280, PCIE GEN4X4, M-KEY, 3D TLC BICS5, PE: 3K, 4CH, WIDE TEM
TS1TMTE712P-VS2
TRANSCEND 128GB, M.2 2242 SSD, SATA3 B+M KEY, 3D TLC BICS5, PE: 3K, EXTENDED TEM
TS128GMTS570T-VS1
TRANSCEND 3840GB, U.2, PCIE GEN4X4, NVME, 3D ETLC BICS5, ENTERPRISE, POWER LOSS
TS3T84ETD410T
TRANSCEND 256GB, 2.5IN SSD, SATA3, 3D TLC BICS5, PE: 3K, EXTENDED TEMP., TCG OPA
TS256GSSD470A-VS1
2TB M.2 2280 PCIE GEN4 X4 PRO SSD
BCT2TB2280PRO
HDD_BO TS 4T PCIE G5 M.2 2280 SSD
4XB1S30116
