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Key Features

  • PCI Express NVMe 3.0 x4 interfaceguarantees quick and reliable data transfer
  • M.2 2280 form factor offers convenience, making it perfect for users seeking easy installation and hassle-free operation
  • Power and energy-efficient design ensures maximum reliability for your SSD
  • Provides expanded storage capacity with optimal efficiency, ensuring you have ample space for all your needs
  • Store unlimited documents, pictures, and videos with the impressive 1 TB capacity
TRANSCEND INFORMATION Hard Drives/Solid State Drives

1TB, M.2 2280, PCIE GEN3X4, M-KEY, 3D TLC BICS4, PE: 3K, 8C

Mfr # TS1TMTE662T2 SKU 6626447 UPC 760557844617

$1,325.33
Available

Contact us to check availability


Product Overview

1TB, M.2 2280, PCIE GEN3X4, M-KEY, 3D TLC BICS4, PE: 3K, 8C

  • 1TB, M.2 2280, PCIe Gen3x4, M-Key, 3D TLC, PE: 3K, 8CH, 30u
  • Transcend MTE662T2 1 TB Solid State Drive - M.2 2280 Internal - PCI Express NVMe (PCI Express NVMe 3.0 x4) - 2 DWPD
  • Transcend MTE662T2 1 TB Solid State Drive - M.2 2280 Internal - PCI Express NVMe (PCI Express NVMe 3.0 x4)

Technical Specifications

Product Type Solid State Drive
Storage Capacity 1 TB
Manufacturer Part Number TS1TMTE662T2
Weight (Approximate) 0.32 oz
Drive Type Internal
Form Factor M.2 2280
Manufacturer Transcend Information, Inc
Product Model MTE662T2
Product Name Solid State Drive
Brand Name Transcend
Height 0.1"
Width 0.9"
Depth 3.1"
Wireless LAN No
Drive Interface PCI Express NVMe
Drive Interface Standard PCI Express NVMe 3.0 x4
Endurance (DWPD) 2

Marketing Information

Transcend's MTE662T2 M.2 SSD features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. The MTE662T2 features state-of-the-art 3D NAND technology, which allows 96 layers of 3D NAND flash chips to be vertically stacked. Compared to 3D NAND at 64 layers, this density breakthrough greatly improves storage efficiency, and its built-in DRAM cache allows faster access. Applied with 30µ" gold finger PCB and Corner Bond technology, the MTE662T2 is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20?~75?.

Shipping & Dimensions

0.01
Weight (lbs)
7.7"
Length
5.1"
Width
0.28"
Height
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